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2023 Call for Papers
Abstracts due October 31, 2022
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12.5 Fabrication of 4-inch GaN/Diamond HEMT in a Compound Semiconductor Foundry
Mo Wu, Global Communication Semiconductors, LLC
Won Sang Lee, RFHIC US Corp.
Daniel Hou, Global Communication Semiconductors, LLC
Kyong Won Lee, RFHIC Corporation
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