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Explore
Our Mission
Board of Directors
Executive Committee
Technical Program Committee
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Conference at a Glance
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2.2 Interfacial strength and fracture toughness in bonded semiconductor materials
Dong Liu, University of Oxford, University of Bristol
Jianbo Liang, Osaka City University, University of Bristol
Naoteru Shigekawa, Osaka City University
Martin Kuball, University of Bristol
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