3.1.2021 Fabrication of High-Performance Compound Semiconductor RF Circuits Using Heterogeneously-Integrated Transistor Chiplets in Interposers

Florian Herrault, HRL Laboratories

[embeddoc url=”http://csmantech.org/wp-content/uploads/Digest/Digests-2021/3.1.2021-060-CS_MANTECH_Final_Paper_Invited_Herrault_HRL_v2.pdf” download=”all” viewer=”google”]

Download Paper