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2026 Call for Papers
Abstract submission date has been extended to November 20th.
2026 Call for Papers
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3.2.2.2024 Improved thermal reliability in base contact of full 3-inch InP Double-HBTs with fT and fmax in excess of 300 GHz
In-Geun Lee, Kyungpook National University
Yong-Soo Jeon, Kyungpook National University
Yonghyun Kim, QSI
Jacob Yun, QSI
Ted Kim, QSI
Hyuk-Min Kwon, QSI
Seung Heon Shin, Korea Polytechnics
Jae-Hak Lee, Kyungpook National University
Kyunghoon Yang, Korea Advanced Institute of Science and Technology
Dae-Hyun Kim, Kyungpook National University
3.2.2.2024 Improved thermal reliability in base contact of full 3-inch InP Double-HBTs