Explore
Our Mission
Board of Directors
Executive Committee
Technical Program Committee
2022 Conference Collage
Sponsors
Exhibitor
Authors
Digests
Contact
Sponsorship Opportunities are available!
Visit our Sponsors page for more information
Explore
Our Mission
Board of Directors
Executive Committee
Technical Program Committee
2022 Conference Collage
Sponsors
Exhibitor
Authors
Digests
Contact
3.2.2.2024 Improved thermal reliability in base contact of full 3-inch InP Double-HBTs with fT and fmax in excess of 300 GHz
In-Geun Lee, Kyungpook National University
Yong-Soo Jeon, Kyungpook National University
Yonghyun Kim, QSI
Jacob Yun, QSI
Ted Kim, QSI
Hyuk-Min Kwon, QSI
Seung Heon Shin, Korea Polytechnics
Jae-Hak Lee, Kyungpook National University
Kyunghoon Yang, Korea Advanced Institute of Science and Technology
Dae-Hyun Kim, Kyungpook National University
Loading...
Taking too long?
Reload document
|
Open in new tab
Download [759.04 KB]