Abstract
Normally-off high-electron-mobility transistors with p-type NiO gate on an N-polar GaN/AlN material platform are demonstrated. A direct comparison with p-NiO gated HEMTs, Metal-Oxide-Semiconductor (MOS)-gated HEMTs and AlN trench MOSFET devices on the same wafer shows the utility of the NiO in shifting the threshold voltage to positive values. HEMTs with a p-NiO gate exhibit a positive threshold voltage of 1.24 V with a high ON/OFF drain current ratio of 107, a yield as high as 70% is achieved. Breakdown voltages of over 3000 V in co-fabricated AlN trench structures highlight the strong potential of the N-polar GaN/AlN platform for power electronic devices. The potential of this technology for future commercialization/manufacturing is demonstrated.
