3B.3 – Metal Additive Micro-Manufacturing to Achieve Enhanced Air-Bridge Geometry for Coplanar Waveguide mm-Wave GaN-on-SiC Integrated Circuits

A. Collier, Cardiff University
A. Eblabla, Cardiff University
W. Sampson, Cardiff University
E. Yadollahifarsi, Cardiff University
E. Hepp, Exaddon AG
R. Conte, Exaddon AG
K. Elgaid, Exaddon AG

3B.3 Final.2025

Abstract
This paper presents a novel cavity coplanar waveguide (CCPW) structure based on GaN-on-SiC technology for high-power microwave applications. The CCPW structure was fabricated using an emerging monolithic microwave integrated circuit (MMIC)-compatible localised electrodeposition metal additive micro-manufacturing (μAM) process, achieving an air-bridge height of 50 μm. Electromagnetic (EM) simulations revealed that introducing a cavity above the CPW improves impedance matching at mm-wave frequencies while providing a robust ground-return path. S-parameter measurements show that the CCPW provides a 6.5 dB improvement in reflection coefficient at 110 GHz compared to a standard coplanar waveguide (CPW) structure. Furthermore, both simulations and measurements indicate a broadband reflection coefficient trough suggesting the potential for broadband impedance matching in MMIC applications. To further analyse RF parasitics, a high-frequency equivalent circuit model was developed, demonstrating significant performance improvements of the CCPW compared to a printed air-bridge.