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Explore
Our Mission
Board of Directors
Executive Committee
Technical Program Committee
2022 Conference Collage
Sponsors
Exhibits
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Digests
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Advance Program Rev. 1
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April 30, 2019 // 4:10pm – 4:30pm
4.2 Investigation of RF Performance of InGaP/GaAs HBT Power Stage with Flip-Chip Bumping Technology
Tung-Yao Chou, WIN Semiconductors Corp.
Dennis Williams, WIN Semiconductors Corp
Yu-Chi Wang, WIN Semiconductors Corp
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