Explore
Our Mission
Board of Directors
Executive Committee
Technical Program Committee
2022 Conference Collage
Sponsors
Exhibitor
Authors
Digests
Contact
Explore
Our Mission
Board of Directors
Executive Committee
Technical Program Committee
2022 Conference Collage
Sponsors
Exhibitor
Authors
Digests
Contact
April 30, 2019 // 4:10pm – 4:30pm
4.2 Investigation of RF Performance of InGaP/GaAs HBT Power Stage with Flip-Chip Bumping Technology
Tung-Yao Chou, WIN Semiconductors Corp.
Dennis Williams, WIN Semiconductors Corp
Yu-Chi Wang, WIN Semiconductors Corp
Download Paper