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2026 Call for Papers
Abstract submission date has been extended to November 20th.
2026 Call for Papers
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April 30, 2019 // 4:10pm – 4:30pm
4.2 Investigation of RF Performance of InGaP/GaAs HBT Power Stage with Flip-Chip Bumping Technology
Tung-Yao Chou, WIN Semiconductors Corp.
Dennis Williams, WIN Semiconductors Corp
Yu-Chi Wang, WIN Semiconductors Corp
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