May 10, 2022 // 4:00pm

5.1 III-V Semiconductor Devices on 6-inch Wafer for sub-Terahertz Communications

Jung-Tao Chung, WIN Semiconductors Corp
Yu-An Liao, WIN Semiconductors Corp.
Jung-Hao Hsu, WIN Semiconductors Corp.
Hsi-Tsung Lin, WIN Semiconductors Corp.
Shu-Hsiao Tsai, WIN Semiconductors Corp
Cheng-Kuo Lin, WIN Semiconductors Corp.
Lung-Yi Tseng, WIN Semiconductors Corp.
Chia-Ming Chang, WIN Semiconductors Corp.

Invited Presentation

[embeddoc url=”https://csmantech.org/wp-content/uploads/2023/09/5.1.2022-III-V-Semiconductor-Devices-on-6-inch-wafer.pdf” download=”all”]

 

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