DARPA’s Next-Generation Microelectronics Manufacturing program, known as NGMM, aims to unlock accessible prototyping for the microelectronics of tomorrow by establishing a national center for advancing U.S.-based 3D heterogeneous integration (3DHI). DARPA is working with The University of Texas at Austin, and its existing Texas Institute for Electronics (TIE) research center, to establish the TIE NGMM Center (TNC) to support 3DHI microelectronics research, development, and low-volume production. NGMM is leveraging partnerships spanning organizations across the defense industrial base, domestic foundries, vendors and startups, designers and manufacturers, members of academia, and other stakeholders to achieve a shared vision for national and economic security. By the program’s end, the center will be capable of producing high-performance 3DHI microsystems at reasonable cost, with cycle times supporting fast-paced innovative research.
2026 Call for Papers Abstract submission date has been extended to November 28th.
