Explore
Our Mission
Board of Directors
Executive Committee
Technical Program Committee
2022 Conference Collage
Sponsors
Exhibitor
Authors
Digests
Contact
Attendee/Exhibitor Registration
Hotel Registration
Explore
Our Mission
Board of Directors
Executive Committee
Technical Program Committee
2022 Conference Collage
Sponsors
Exhibitor
Authors
Digests
Contact
Attendee/Exhibitor Registration
Hotel Registration
6.1.3.2024 SmartSiC™ 150 & 200mm engineered substrate: increasing SiC power device current density up to 30%
Eric Guiot, SOITEC
Frédéric Allibert, SOITEC
Jürgen Leib, Fraunhofer IISB
Tom Becker, Fraunhofer IISB
Oleg Rusch, Fraunhofer IISB
Alexis Drouin, SOITEC
Walter Schwarzenbach, SOITEC
Loading...
Taking too long?
Reload document
|
Open in new tab
Download [1.33 MB]