6.3.2021 Implementation of End Point Detection for Compound Semiconductor Wafer Thinning Applications and Investigation of Gallium Arsenide Etch Rates and Surface Roughness

Phillip Tyler, Veeco Instruments – Precision Surface Processing

Jonathan Fijal, Veeco Instruments – Precision Surface Processing

Ian Cochran, Veeco Instruments – Precision Surface Processing

John Taddei, Veeco Instruments – Precision Surface Processing

Eric Tucker, Veeco Instruments – MOCVD

Soo Min Lee, Veeco Instruments – MOCVD

Eric Armour, Veeco Instruments – MOCVD

Christine Notarangelo, Veeco Instruments – MOCVD

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