6.3.2021 Implementation of End Point Detection for Compound Semiconductor Wafer Thinning Applications and Investigation of Gallium Arsenide Etch Rates and Surface Roughness

Phillip Tyler, Veeco Instruments – Precision Surface Processing
Jonathan Fijal, Veeco Instruments – Precision Surface Processing
Ian Cochran, Veeco Instruments – Precision Surface Processing
John Taddei, Veeco Instruments – Precision Surface Processing
Eric Tucker, Veeco Instruments – MOCVD
Soo Min Lee, Veeco Instruments – MOCVD
Eric Armour, Veeco Instruments – MOCVD
Christine Notarangelo, Veeco Instruments – MOCVD
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