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2026 Call for Papers
Abstract submission date has been extended to November 28th.
2026 Call for Papers
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6a.2 Inductively Coupled Plasma Dry Etching Process Development for > 50 Gb/s 850 nm Oxide-Confined VCSELs
Michael Liu
Curtis Wang, University of Illinois at Urbana-Champaign
Milton Feng, University of Illinois Urbana-Champaign
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