Abstract
This paper presents Circuits Integrated Hellas’s (CIH) innovative use of III-V compound semiconductors with advanced 3D packaging. CIH introduces disruptive, high-performance solutions for satellite communication (SatCom) applications, leveraging System-in-Package (SiP) and Antenna-in-Package (AiP) methodologies. These approaches minimize the weight, volume, and cost of flat-panel phased array antennas, addressing a critical need in modern space communications
