6a.3 Reduction of Thin Film Stress-induced Micro-masking by Using Ti/Ni Hard Mask for High Power SiC Transistor Fabrication - CS MANTECH Conference CS MANTECH Conference

Attendee Registration OPEN! Exhibit Hall is sold out

6a.3 Reduction of Thin Film Stress-induced Micro-masking by Using Ti/Ni Hard Mask for High Power SiC Transistor Fabrication

Shamima Afroz, Northrop Grumman

Jason Thomen, Northrop Grumman Corporation

James Oliver, Northrop Grumman Corporation

Evan Jones, Wolfspeed | A Cree Company

Download Paper