7a.5 Near Junction Thermal Transport and Embedded Cooling of High Power GaN Electronics

Carlton Creamer, BAE Systems Inc
P. C. Chao, MEC, BAE Systems, IQE
K K Chu, BAE Systems
A Kassinos, BAE Systems
G Campbell, Science Research Laboratories, Inc.
H Eppich, Science Research Laboratories, Inc.
A Shooshtari, University of Maryland
S Dessiatoun, University of Maryland
M Ohadi, University of Maryland
C McGray, Modern Microsystems
R Kallaher, Modern Microsystems
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