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May 01, 2019 // 11:40am – 12:10pm
8.4 CMP Process Development on III-V Substrates for 3D Heterogeneous Integration
Miguel Urteaga, Teledyne Scientific Company
Andy Carter, Teledyne Scientific Company
Sangki Hong, Nhanced Semiconductor
Robert Patti, Nhanced Semiconductor
Carl Petteway, Nhanced Semiconductor
Gill Fountain, Nhanced Semiconductor
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