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2026 Call for Papers
Abstract submission date has been extended to November 28th.
2026 Call for Papers
Explore
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8.5.2023 Atomic Diffusion Bonding Using AlN and Al2O3 Films
T. Saito, Canon ANELVA Corporation
H. Makita, Canon ANELVA Corporation
Y. Suzuki, Canon ANELVA Corporation
Y. Kozuka, Canon ANELVA Corporation
A. Muraoka, Canon ANELVA Corporation
H. Fukunaga, FRIS, Tohoku University
M. Uomoto, FRIS, Tohoku University
T. Shimatsu, FRIS, Tohoku University
8.5.2023 Extended abstract Saito Canon ALNELVA_final ver