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Explore
Our Mission
Board of Directors
Executive Committee
Technical Program Committee
Sponsors
Authors
Exhibits
Digests
Contact
40th Anniversary (2026)
Best Poster-Awards
Best Paper History
Conference Chair History
A Mathematical Model to Determine the Impact of Through-Wafer-Vias on Backside Plating Thickness
Jens Riege, Skyworks Solutions, Inc.
Skyworks Solutions
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