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Explore
Our Mission
Board of Directors
Executive Committee
Technical Program Committee
Conference
Conference at a Glance
Advance Program & Sessions
Sponsors
Exhibitor
Exhibitor Floorplan
Exhibitor add-ons
Authors
Digests
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A Mathematical Model to Determine the Impact of Through-Wafer-Vias on Backside Plating Thickness
Jens Riege, Skyworks Solutions, Inc.
Skyworks Solutions
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