An Integration of On-Chip High-Q Inductors by Cu Redistribution Layer (RDL) with Bumping for InGaP/GaAs HBT MMIC

Jung-Hao Hsu, WIN Semiconductors Corp.
Shu-Hsiao Tsai, WIN Semiconductors Corp
Shih-Wei Chen, WIN Semiconductors Corp.
Kay Wu, WIN Semiconductors Corp.
Cheng-Kuo Lin, WIN Semiconductors Corp
and Dennis Williams, WIN Semiconductors Corp.
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