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Explore
Our Mission
Board of Directors
Executive Committee
Technical Program Committee
2022 Conference Collage
Sponsors
Exhibitor
Authors
Digests
Contact
Analysis and Optimization of a Through Substrate Via Etch Process for Silicon Carbide Substrates
Andreas Thies, Ferdinand-Braun-Institut
Wilfred John, Ferdinand-Braun-Institut
Stephan Freyer, Ferdinand-Braun-Institut
Jaime Beltran, LayTec AG.
Olaf Krüger, Ferdinand-Braun-Institut
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