15.3 Characterization of Electrostatic Chuck (ESC) Performance with Changes in Wafer Warpage, and Backside Cooling Conditions - CS MANTECH Conference CS MANTECH Conference

May 12, 2022 // 11:30am

15.3 Characterization of Electrostatic Chuck (ESC) Performance with Changes in Wafer Warpage, and Backside Cooling Conditions

Saman Parizi, Qorvo, USA

Eleanor Rackoff, Qorvo, USA

John Setty, Qorvo, USA

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