Device Characteristics Analysis of GaAs/InGaP HBT Power Cells Using Conventional Through Wafer Via Process and Copper Pillar Bump Process

Hsiu-Chen Chang
Shu-Hsiao Tsai, WIN Semiconductors Corp
Cheng-Kuo Lin, WIN Semiconductors Corp
Tim Hsiao
Steven Chou
C. Chen, Momentive Technologies
Pi-Hsia Wang
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