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2026 Call for Papers
Abstract submission date has been extended to November 20th.
2026 Call for Papers
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Effect of Multi-Field Plates on GaN-on-Silicon HEMTs Reverse Breakdown and Leakage Characteristics
T. Boles, MACOM Technology Solutions, Lincoln Laboratory
D. Carlson, MACOM Technology Solutions, Lincoln Laboratory
L. Xia, MACOM Technology Solutions, Lincoln Laboratory
A. Kaleta, MACOM Technology Solutions, Lincoln Laboratory
C. McLean, MACOM Technology Solutions, Lincoln Laboratory
D. Jin, MACOM Technology Solutions, Lincoln Laboratory
T. Palacios, MACOM Technology Solutions, Lincoln Laboratory
G. W. Turner, MACOM Technology Solutions, Lincoln Laboratory
R. J. Molnar, MACOM Technology Solutions, Lincoln Laboratory
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