This paper presents a novel surface finishing process and consumables for achieving an epi-ready finish on the Al-face of Aluminum Nitride (AlN) single crystal substrates and wafers. The designed combination of process parameters and newly developed slurries produces superior surface finish on the Al-face of AlN substrates and high removal rates yielding in significant reduction of wafer surface finishing process times for stock removal and chemical-mechanical polishing (CMP) steps.