Effective Polishing of Al-face of AlN Substrates using Advanced Polishing Process and Consumables

Alicia Walters, Engis Corporation
Artem Titov, Engis Corporation

This paper presents a novel surface finishing process and consumables for achieving an epi-ready finish on the Al-face of Aluminum Nitride (AlN) single crystal substrates and wafers. The designed combination of process parameters and newly developed slurries produces superior surface finish on the Al-face of AlN substrates and high removal rates yielding in significant reduction of wafer surface finishing process times for stock removal and chemical-mechanical polishing (CMP) steps.

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