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Fabrication of III-V virtual Substrate on 200 mm Silicon for III-V and Si Devices Integration
David Kohen, ASM Belgium
Riko I Made, Singapore-MIT Alliance for Research and Technology Center
Shuyu Bao, Singapore-MIT Alliance for Research and Technology Center
Kwang Hong Lee, Singapore-MIT Alliance for Research and Technology
Kenneth Eng Kian Lee, Singapore-MIT Alliance for Research and Technology
Chuan Seng Tan, Nanyang Technological University
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