Fabrication of III-V virtual Substrate on 200 mm Silicon for III-V and Si Devices Integration

David Kohen, ASM Belgium

Riko I Made, Singapore-MIT Alliance for Research and Technology Center

Shuyu Bao, Singapore-MIT Alliance for Research and Technology Center

Kwang Hong Lee, Singapore-MIT Alliance for Research and Technology

Kenneth Eng Kian Lee, Singapore-MIT Alliance for Research and Technology

Chuan Seng Tan, Nanyang Technological University

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