18.14 GaN Wafer Level AuSn Solder Deposition Wen Zhu, Kanin Chu, and Blair Coburn BAE Systems, Nashua, NH USA - CS MANTECH Conference CS MANTECH Conference

May 12, 2022 // 3:20pm

18.14 GaN Wafer Level AuSn Solder Deposition Wen Zhu, Kanin Chu, and Blair Coburn BAE Systems, Nashua, NH USA

Wen Zhu, BAE Systems Inc

Kanin Chu, BAE Systems Inc

Blair Coburn, BAE Systems

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