Explore
Our Mission
Board of Directors
Executive Committee
Technical Program Committee
2022 Conference Collage
Sponsors
Exhibitor
Authors
Digests
Contact
2025 Second Call for Papers
Authors link
Abstract Submission Site is LIVE!
The first 10 abstracts submitted and accepted will be eligible for a prize drawing.
Submission Link
Explore
Our Mission
Board of Directors
Executive Committee
Technical Program Committee
2022 Conference Collage
Sponsors
Exhibitor
Authors
Digests
Contact
2025 Second Call for Papers
Authors link
Layout Practices for Die Size Reduction on InGaP/GaAs HBT MMICs for Handset Power Amplifier Applications
Shu-Hsiao Tsai, WIN Semiconductors Corp
Rong-Hao Syu
Yu-Ling Chen
Wen-Fu Yu
Cheng-Kuo Lin, WIN Semiconductors Corp
Download Paper
