12.4 Novel thermoreflectance-based method for in-situ die attach thermal conductivity assessment in packaged devices

May 11, 2022 // 5:30pm

Zeina Abdallah, University of Bristol

Nathawat Poopakdec, University of Bristol, Bristol, UK and Navaminda Kasatriyadhiraj Royal Air Force Academny

Martin Kuball, University of Bristol

James Pomeroy, University of Bristol

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