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Explore
Our Mission
Board of Directors
Executive Committee
Technical Program Committee
Conference
Conference at a Glance
Advance Program & Sessions
Sponsors
Exhibitor
Exhibitor Floorplan
Exhibitor add-ons
Authors
Digests
Contact
Optimization Methodology of Clean Pads Selection for Lifetime and Test Yield on RF bump Wafer Test with Membrane Probe Card
I-Pin Chia, WIN Semiconductor
Min-Chang Tu, WIN Semiconductor
Paul Yeh, WIN Semiconductor
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