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About Us
Our Mission
Board of Directors
Executive Committee
Technical Program Committee
Schedule
Digests
Sponsors
Contact
Attendee Registration
Qualification of Backside Via Etch Process in GaN-on-SiC HEMT Devices
Frank Fan, Global Communication Semiconductors, LLC
Minkar Chen, Global Communications Seminconductor, LLC
Daniel Hou, Global Communication Semiconductors, LLC
David Wang, Global Communication Semiconductors, LLC
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