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Explore
Our Mission
Board of Directors
Executive Committee
Technical Program Committee
2022 Conference Collage
Sponsors
Exhibitor
Authors
Digests
Contact
Qualification of Backside Via Etch Process in GaN-on-SiC HEMT Devices
Frank Fan, Global Communication Semiconductors, LLC
Minkar Chen, Global Communications Seminconductor, LLC
Daniel Hou, Global Communication Semiconductors, LLC
David Wang, Global Communication Semiconductors, LLC
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