May 12, 2022 // 3:20pm

18.18 Reduction in Thermal Boundary Conductance of Annealed Direct Wafer Bonded GaN|Si Heterojunction Interfaces

K. Huynh, University of California, Los Angeles, CA USA
M. E. Liao, University of California, Los Angeles, CA USA
V. Dragoi, EV Group
Eric Guiot, SOITEC
Raphael Caulmilone, SOITEC
M.S. Goorsky, University of California, Los Angeles, CA USA
X. Yan, University of California Irvine
T. Pfeifer, University of Virginia Charlottesville
N. Razek, EV Group and R-Ray Medical
X. Pan, Soitec
P. E. Hopkin, University of Virginia Charlottesville
J. Tomko, University of Virginia Charlottesville

Student Presentation

Download Paper