Wafer Level Packaging for Electronic RF Systems Using GaN Technologies

Ulli Hansen
Hermann Stieglauer, United Monolithic Semiconductors GmbH
Klaus Riepe
Janina Moereke

The main objective of the Covered Gallium Nitride (CoGaN) project is the demonstration of the electrical performance of a GaN HPA in a frequency range between 25 GHz and 40 GHz with a maximal output power of 5 W in a chip scale packaging technology for 5G applications. In addition, requirements are existing for reliability testing at THB condition of 85°C/85% rel. humidity. In this work a test vehicle circuit with a pre matched 1 mm transistor is used for showing the process feasibility.

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