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Alex Wood
SPTS Technologies Ltd.
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20.12 Backside Via Process with Defect Free Sidewalls for GaN MMIC Applications
Kyu Jun Cho, ETRI (Electronics and Telecommunications Research Institute)Byong Gue Min, ETRI (Electronics and Telecommunications Research Institute)Ho Kyun Ahn, Electronics and Telecommunications Research InstituteHae Cheon Kim, ETRI (Electronics and Telecommunications Research Institute)Hyung Sup Yoon, Electronics and Telecommunications Research InstituteHyun-Wook Jung, ETRI (Electronics and Telecommunications Research Institute)Jae-Won Do, ETRI (Electronics and Telecommunications Research Institute)Min Jeong Shin, ETRI (Electronics and Telecommunications Research Institute)Sung-Jae Chang, ETRI (Electronics and Telecommunications Research Institute)Jong Won Lim, Electronics and Telecommunications Research InstituteAnthony Barker, SPTS Technologies Ltd.Alex Wood, SPTS Technologies Ltd.Kevin Riddell, SPTS, Newport, UKGordon Horsley, SPTS Technologies Ltd.Dave Thomas, SPTS Technologies Ltd. -
9.2.2021 State-of-the-Art Etch and Deposition Processing of highly doped ScAlN for 5G and Wi-Fi Filter Applications
Anthony Barker, SPTS Technologies Ltd.Kevin Riddell, SPTS, Newport, UKAlex Wood, SPTS Technologies Ltd.Download Paper