Pad conditioning is critical to maintaining the required process stability and performance in semiconductor CMP. As the process and performance requirements for substrate polishing in the compound semiconductor industry become more stringent, we believe there are significant opportunities for improvement via more extensive adoption of optimized pad conditioning protocols. In this paper we will review the pertinent state of the art in semiconductor CMP and propose some specific target areas for adoption in compound semiconductor substrate polishing.
Kinik North America
CMP Pad Conditioning and Applications to Compound Semiconductor Wafer ProcessingTerry Knight, Eminess TechnologiesAndrew Lawing, Kinik North AmericaWilliam Gemmill, Eminess TechnologiesDownload Paper