We report the dispersion characteristics of ScAlN/GaN high-electron-mobility transistors (HEMTs) with various epitaxial designs. Devices were fabricated on both ternary (ScAlN) and quaternary (ScAlGaN) materials. The effects of a GaN capping layer was also investigated. We report similar DC and RF performance for all wafers, but significantly worse dispersion which occurs on the quaternary samples. We observe a total gate and drain lag for the ScAlN wafer to be 49% while the ScAlGaN with and without the GaN cap had 10 and 12% dispersion, respectively.
Antonio Crespo
Air Force Research Laboratory, Sensors Directorate
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James Gillespie, Air Force Research LaboratoryKelson Chabak, Air Force Research Laboratory, Sensors DirectorateAntonio Crespo, Air Force Research Laboratory, Sensors DirectorateRobert Fitch, AFRLDarren Ferwalt, Cobham Advanced Electronic SystemsDavid Frey, Cobham Advanced Electronic SystemsJeremy Gassmann, Cobham Advanced Electronic SystemsMark Walker, Cobham Advanced Electronic SolutionsRyan Gilbert, Wyle LaboratoriesDennis Walker Jr, Air Force Research Laboatory, Sensors DirectorateGlen Via, AFRLA.J. GreenK.D. LeedyR.K. MongiaB.S. PolingK.A. SutherlinS.E. TetlakJ.P. TheimerG.H. Jessen