Blair Coburn

BAE Systems
  • May 12, 2022 // 3:20pm

    18.14 GaN Wafer Level AuSn Solder Deposition Wen Zhu, Kanin Chu, and Blair Coburn BAE Systems, Nashua, NH USA

    Wen Zhu, BAE Systems Inc
    Kanin Chu, BAE Systems Inc
    Blair Coburn, BAE Systems

    Abstract

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