Abstract
Lithium Niobate (LN) substrates are prone to breakage through thermal shock. Thermal cycling is necessary for several processes in a wafer factory. To process LN wafers as quickly as possible without breaking these substrates, the mechanism for this breakage was investigated and found to be principally due to the cooling rate of the process.
D. Allen
Qorvo, Inc.
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12.15 – Improving Wafer Breakage Through Peak Cooling Rate Reduction on Lithium Niobate Substrates
D. Allen, Qorvo, Inc.A. Bharathi, Qorvo, Inc.