Abstract
This paper presents the thermal benefits of a heterogeneous integration (HI) technique for multi-chip assembly. The Metal Embedded Chip Assembly (MECA) process was used on a single thermal test chip to assess the thermal benefits of the embedded copper heat sink. Measurements were taken from the diodes on the thermal test chip as well as from the thermal images recorded with infrared camera. Simulation was done using COMSOL and are in unison agreement with the experimental results.
D. T. Reyes
Air Force Research Laboratory, Sensors Directorate
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6A.4 – Quantifying Thermal Benefits of Metal Embedded Chip Assembly as a Heterogeneous Integration Approach
J. Beagle, Air Force Research Laboratory, Sensors DirectorateK. DeVore, MACOM Technology SolutionsJ. Pastrana, Air Force Research Laboratory, Sensors DirectorateJ. Figueroa, Air Force Research Laboratory, Sensors DirectorateG. Morales, Michigan State UniversityL. Colon-Santiago, Michigan State UniversityF. Ouchen, KBR, Inc.E. Kreit, Air Force Research Laboratory, Sensors DirectorateD. T. Reyes, Air Force Research Laboratory, Sensors Directorate