Daniel Hou

Global Communication Semiconductors, LLC

  • 12.5 Fabrication of 4-inch GaN/Diamond HEMT in a Compound Semiconductor Foundry

    Mo Wu, Global Communication Semiconductors, LLC
    Won Sang Lee, RFHIC US Corp.
    Daniel Hou, Global Communication Semiconductors, LLC
    Kyong Won Lee, RFHIC Corporation
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  • May 01, 2019 // 4:20pm – 4:40pm

    12.2 The State-of-Art of GaN/Diamond HEMT Manufacturing Technology And Device Performance

    Daniel Hou, Global Communication Semiconductors, LLC
    Dan Benveniste, Global Communciation Semiconductors, LLC
    Riccardo Soligo, Global Communciation Semiconductors, LLC
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