Abstract
This paper presents Circuits Integrated Hellas’s (CIH) innovative use of III-V compound semiconductors with advanced 3D packaging. CIH introduces disruptive, high-performance solutions for satellite communication (SatCom) applications, leveraging System-in-Package (SiP) and Antenna-in-Package (AiP) methodologies. These approaches minimize the weight, volume, and cost of flat-panel phased array antennas, addressing a critical need in modern space communications
E. Lourandakis
Circuits Integrated Hellas IKE
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6A.3 – Heterogeneous AiP/SiP for Satcom
E. Lourandakis, Circuits Integrated Hellas IKEP. Fioravanti, Circuits Integrated Hellas IKEG. Kontogiannopoulos, Circuits Integrated Hellas IKEC. McMahon, Circuits Integrated Hellas IKE
