12.10 Final.2025

Abstract
At ATL, innovation drives the development of new technologies to meet customer needs, including in the semiconductor fabrication process. Shifts in processing can lead to issues like cross-contamination, impacting processes such as L-Band power transistor production. Residue left after photoresist strip processes caused concerns, affecting wafer quality and potentially leading to emitter-base shorts. Through a rigorous investigation and experimentation with different photoresist strip methods, a more effective approach using an alternate Asher tool was found. Implementing this new method significantly reduced residue, improving production yield and resolving process challenges in semiconductor manufacturing at ATL.