Eric Armour

Veeco Instruments – MOCVD

  • 6.3.2021 Implementation of End Point Detection for Compound Semiconductor Wafer Thinning Applications and Investigation of Gallium Arsenide Etch Rates and Surface Roughness

    Phillip Tyler, Veeco Instruments – Precision Surface Processing
    Jonathan Fijal, Veeco Instruments – Precision Surface Processing
    Ian Cochran, Veeco Instruments – Precision Surface Processing
    John Taddei, Veeco Instruments – Precision Surface Processing
    Eric Tucker, Veeco Instruments – MOCVD
    Soo Min Lee, Veeco Instruments – MOCVD
    Eric Armour, Veeco Instruments – MOCVD
    Christine Notarangelo, Veeco Instruments – MOCVD
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