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Eric Armour
Veeco Instruments – MOCVD
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6.3.2021 Implementation of End Point Detection for Compound Semiconductor Wafer Thinning Applications and Investigation of Gallium Arsenide Etch Rates and Surface Roughness
Phillip Tyler, Veeco Instruments – Precision Surface ProcessingJonathan Fijal, Veeco Instruments – Precision Surface ProcessingIan Cochran, Veeco Instruments – Precision Surface ProcessingJohn Taddei, Veeco Instruments – Precision Surface ProcessingEric Tucker, Veeco Instruments – MOCVDSoo Min Lee, Veeco Instruments – MOCVDEric Armour, Veeco Instruments – MOCVDChristine Notarangelo, Veeco Instruments – MOCVDDownload Paper