G Campbell

Science Research Laboratories, Inc.

  • 7a.5 Near Junction Thermal Transport and Embedded Cooling of High Power GaN Electronics

    Carlton Creamer, BAE Systems Inc
    P. C. Chao, MEC, BAE Systems, IQE
    K K Chu, BAE Systems
    A Kassinos, BAE Systems
    G Campbell, Science Research Laboratories, Inc.
    H Eppich, Science Research Laboratories, Inc.
    A Shooshtari, University of Maryland
    S Dessiatoun, University of Maryland
    M Ohadi, University of Maryland
    C McGray, Modern Microsystems
    R Kallaher, Modern Microsystems
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