Hal Banbrook

  • Evaluation of Material and Process Contributions to BiFET Variation Using Design of Experiments

    Peter J. Zampardi, Qorvo, Inc.
    Cristian Cismaru, Skyworks Solutions, Inc.
    Hal Banbrook
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  • Balancing Electrical and Thermal Device Characteristics: Thru Wafer Vias vs. Backside Thermal Vias

    Cristian Cismaru, Skyworks Solutions, Inc.
    Hal Banbrook