Hyung Sup Yoon

Electronics and Telecommunications Research Institute

  • 20.12 Backside Via Process with Defect Free Sidewalls for GaN MMIC Applications

    Kyu Jun Cho, ETRI (Electronics and Telecommunications Research Institute)
    Byong Gue Min, ETRI (Electronics and Telecommunications Research Institute)
    Ho Kyun Ahn, Electronics and Telecommunications Research Institute
    Hae Cheon Kim, ETRI (Electronics and Telecommunications Research Institute)
    Hyung Sup Yoon, Electronics and Telecommunications Research Institute
    Hyun-Wook Jung, ETRI (Electronics and Telecommunications Research Institute)
    Jae-Won Do, ETRI (Electronics and Telecommunications Research Institute)
    Min Jeong Shin, ETRI (Electronics and Telecommunications Research Institute)
    Sung-Jae Chang, ETRI (Electronics and Telecommunications Research Institute)
    Jong Won Lim, Electronics and Telecommunications Research Institute
    Anthony Barker, SPTS Technologies Ltd.
    Alex Wood, SPTS Technologies Ltd.
    Kevin Riddell, SPTS, Newport, UK
    Gordon Horsley, SPTS Technologies Ltd.
    Dave Thomas, SPTS Technologies Ltd.
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