Jan Campbell

  • Final Module Yield Improvement by Increasing the Adhesion of SU8 to Microelectronic Devices using a DMAIC approach

    Jan Campbell
    Martin Ivie
    Qizhi He
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  • Reducing Defects Using a 5x Stepper in Pattering 80 µm SU8 on MEMS Devices

    Jean-François Bédard
    Jan Campbell
    Martin Ivie
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  • Back to the Future: How Implementing Retro-Style Processing Can be an Improvement

    Martin Ivie
    Jan Campbell
    Qizhi He
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  • Improved T-Gate Yield Using E-Beam Trilayer Resist Process

    Huatang Chen, TriQuint Semiconductor, TX
    Andrew Ketterson, Qorvo Inc.
    Marcus King, TriQuint Semiconductor, TX
    Keith Salzman, TriQuint Semiconductor, TX
    Vicki Milam, TriQuint Semiconductor, TX
    James Halvorson, TriQuint Semiconductor, TX
    Jan Campbell

  • The Use of a Structured Approach to Solve Yield Limiting Defects in a Compound Semiconductor Factory

    Jan Campbell
    Qizhi He
    Howie Yang, TriQuint Semiconductor,TX
    Martin Ivie
    John Gibbon, Qorvo
    Darrel Lupo, TriQuint Semiconductor,TX
    Dario Nappa, TriQuint Semiconductor,TX
    Jerry Beene, TriQuint Semiconductor,TX

  • Implementation of Value Added Kaizens (VAK) in a GaAs Manufacturing Facility

    Jan Campbell
    Rick Cobo, TriQuint Semiconductor, TX
    David Beene, TriQuint Semiconductor, TX
    Jerry Beene, TriQuint Semiconductor,TX
    Gary Head
    Martin Ivie
    Pavan Bhatia,  Brewer Science, TriQuint Semiconductor
    Greg Baker, TriQuint Semiconductor, TX

  • ADHESION CHARACTERIZATION OF PHOTO-DEFINABLE EPOXIES ON HIGH ASPECT RATIO STRUCTURES FOR HIGH PERFORMANCE APPLICATIONS

    Jan Campbell
    Qizhi He