Jens Riege
Skyworks Solutions, Inc.
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A Mathematical Model to Determine the Impact of Through-Wafer-Vias on Backside Plating Thickness
Jens Riege, Skyworks Solutions, Inc.Skyworks Solutions -
Improved Availability for Copper Plater Tools
Patrick Santos, Skyworks Solutions, Inc.Jens Riege, Skyworks Solutions, Inc. -
Plating Showerhead System for Improved Backside Wafer Plating
Jens Riege, Skyworks Solutions, Inc.Heather Knoedler, Skyworks SolutionsShiban Tiku, Skyworks Solutions, Inc.Nercy Ebrahimi, Skyworks Solution Inc. -
A New Method for Creating Sloped Resist Profiles Using Mask Structures
Jens Riege, Skyworks Solutions, Inc.Samuel Mony, Skyworks Solutions, Inc.Nercy Ebrahimi, Skyworks Solution Inc. -
April 30, 2019 // 2:40pm – 3:10pm
3.4 Implementation of Automated Process Dashboards
Jens Riege, Skyworks Solutions, Inc.