Jens Riege

Skyworks Solutions, Inc.

  • A Mathematical Model to Determine the Impact of Through-Wafer-Vias on Backside Plating Thickness

    Jens Riege, Skyworks Solutions, Inc.
    Skyworks Solutions
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  • Improved Availability for Copper Plater Tools

    Patrick Santos, Skyworks Solutions, Inc.
    Jens Riege, Skyworks Solutions, Inc.
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  • Plating Showerhead System for Improved Backside Wafer Plating

    Jens Riege, Skyworks Solutions, Inc.
    Heather Knoedler, Skyworks Solutions
    Shiban Tiku, Skyworks Solutions, Inc.
    Nercy Ebrahimi, Skyworks Solution Inc.

  • A New Method for Creating Sloped Resist Profiles Using Mask Structures

    Jens Riege, Skyworks Solutions, Inc.
    Samuel Mony, Skyworks Solutions, Inc.
    Nercy Ebrahimi, Skyworks Solution Inc.
  • April 30, 2019 // 2:40pm – 3:10pm

    3.4 Implementation of Automated Process Dashboards

    Jens Riege, Skyworks Solutions, Inc.
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