11.2 High selectivity GaN to AlGaN etching for HEMT devices (Matt Day – KLA-PSMC) – FINAL
Jia-Wei Hsu
PSMC (Fab 8B)
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11.2.2023 High selectivity GaN to AlGaN etching for HEMT devices
Will Worster, Swansea UniversityWill Worster, KLA Corporation (SPTS Division)Richard Barnett, KLA Corporation (SPTS Division)Jih-Wen Chou, PSMC (8” Tech Dev Center)Robin Chistine Hwang, PSMC (8” Tech Dev Center)Yen-Ling Chuang, PSMC (Fab 8B)Jia-Wei Hsu, PSMC (Fab 8B)