Jianbo Liang

Osaka City University, University of Bristol

  • 2.2 Interfacial strength and fracture toughness in bonded semiconductor materials

    Dong Liu, University of Oxford, University of Bristol
    Jianbo Liang, Osaka City University, University of Bristol
    Naoteru Shigekawa, Osaka City University
    Martin Kuball, University of Bristol
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