John Coudriet

Qorvo

  • 3.3.2021 Wafer Breakage Reduction in Cu Bump Processing of GaAs Technologies

    Chang’e Weng, Qorvo
    Tina Kebede, Qorvo
    April Morilon, Qorvo
    Jesse Walker, Qorvo
    Kris Zimmerman, Qorvo
    Lee Tye, Qorvo
    John Coudriet, Qorvo
    Josh Ochoa, Qorvo
    Jeff Moran, Qorvo
    Matthew Porter, Qorvo
    Kenneth P. Reis, Qorvo

    [embeddoc url=”http://csmantech.org/wp-content/uploads/Digest/Digests-2021/3.3.2021-Wafer-Breakage-Reduction-in-Cu-process_Final-Rev1.pdf” download=”all” viewer=”google”]

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